Flip chip interconnections on electronic modules

Details Flip chip interconnections on electronic modules Flip chip interconnections on electronic modules

1999-02-01

2000-01-04

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257772, 257779, 257771, 257741, 257738, 257737, 257765, 257764, 257762, 257766, 257786, 257784, 22818022, 361779, 29840, H01L 2348

Patent

active

060113138

ABSTRACT:
A device which utilizes flip chip technology to provide interconnection between printed circuit boards and integrated circuits is disclosed. The method involves metallization of the bond pad and multiple, novel bump compositions and coating compositions to provide an interconnection which is reliable and which withstands differences in the coefficient of thermal expansion between the silicon device and the bump material.

REFERENCES:
patent: 3839727 (1974-10-01), Herdzik et al.
patent: 4837609 (1989-06-01), Gurvitch et al.
patent: 4887760 (1989-12-01), Yoshino et al.
patent: 5120678 (1992-06-01), Moore et al.
patent: 5134460 (1992-07-01), Brady et al.
patent: 5227812 (1993-07-01), Watanabe et al.
patent: 5251806 (1993-10-01), Agarwala et al.
patent: 5258648 (1993-11-01), Lin
patent: 5342999 (1994-08-01), Frei et al.
patent: 5349500 (1994-09-01), Casson et al.
patent: 5401689 (1995-03-01), Frei et al.
patent: 5431328 (1995-07-01), Chang et al.
patent: 5452842 (1995-09-01), Melton et al.
patent: 5454160 (1995-10-01), Nickel
patent: 5470787 (1995-11-01), Greer
patent: 5477419 (1995-12-01), Goodman et al.
patent: 5508229 (1996-04-01), Baker
patent: 5542174 (1996-08-01), Chiu
patent: 5611481 (1997-03-01), Akamatsu et al.
patent: 5634268 (1997-06-01), Dalal et al.
patent: 5698465 (1997-12-01), Lynch et al.
patent: 5729896 (1998-03-01), Dalal et al.
patent: 5796591 (1998-08-01), Dalal et al.
patent: 5808360 (1998-09-01), Akram
patent: 5816478 (1998-10-01), Kaskoun et al.
Metals Handbook, vol. 8, 8.sup.th Edition, ASM 1973, pp. 270, 312 and 336.

Affiliated with

Also associated with

Rating

Flip chip interconnections on electronic modules does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip chip interconnections on electronic modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip interconnections on electronic modules will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1074742