Flip chip die assembly using thin flexible substrates

Details Flip chip die assembly using thin flexible substrates Flip chip die assembly using thin flexible substrates

2007-06-05

2007-06-05

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

On insulating substrate or layer

C257SE21703

Reexamination Certificate

active

11166461

ABSTRACT:
Apparatus and methods for flattening thin substrate surfaces by stretching thin flexible substrates to which ICs can be bonded. Various embodiments beneficially maintain the substrate flatness during the assembly process through singulation. According to one embodiment, the use of a window frame type component carrier allows processing of thin laminates and flex films through various manufacturing processes. The flexible substrate is bonded to a rigid carrier. The carrier is placed into a specialized fixture comprising a bottom plate and a top plate. The bottom plate with raised regions is created that allows the windowed region of the flex film to be pressed flat. After aligning the top plate, the bottom plate, and the middle structure, the plates are pressed together causing the raised regions to push the flex film substrate upward and around the carrier. By pressing the thin substrate upward, the substrate is stretched like a drum head over the raised sections of the bottom plate, thereby flattening the substrate. The die assembly site is held flat overtop of the raised portion of the carrier to provide a stable vase for placement of the die.

REFERENCES:
patent: 4980219 (1990-12-01), Hiraide et al.
patent: 5877043 (1999-03-01), Alcoe et al.
patent: 6015722 (2000-01-01), Banks et al.
patent: 6020218 (2000-02-01), Shim et al.
patent: 6060341 (2000-05-01), Alcoe et al.
patent: 6080603 (2000-06-01), Distefano et al.
patent: 6711312 (2004-03-01), Kornrumpf et al.
patent: 6780747 (2004-08-01), Distefano et al.
patent: 2001/0006252 (2001-07-01), Kim et al.
patent: 2001/0052642 (2001-12-01), Wood et al.
patent: 2002/0090749 (2002-07-01), Simmons
patent: 2002/0110956 (2002-08-01), Kumamoto et al.
patent: 2002/0114144 (2002-08-01), Kumamoto et al.
patent: 2003/0166312 (2003-09-01), Lee
patent: 2003/0176014 (2003-09-01), Hofmann
patent: 2004/0053443 (2004-03-01), Kumamoto et al.
patent: 2004/0117985 (2004-06-01), Chung et al.
patent: 2004/0197955 (2004-10-01), Lee
patent: 2004/0201390 (2004-10-01), Farnworth et al.
patent: 2004/0207052 (2004-10-01), Joshi et al.
patent: 2005/0201670 (2005-09-01), Uchiyama
patent: 2006/0134813 (2006-06-01), Wei et al.
patent: 2006/0134922 (2006-06-01), Taussig et al.
patent: 2006/0160278 (2006-07-01), Mei
patent: 1 204 137 (2002-05-01), None
patent: 2000-260814 (2000-09-01), None
patent: 2002-009108 (2002-01-01), None
patent: 2003-124256 (2003-04-01), None
patent: 2003-297879 (2003-10-01), None
patent: 2004-039802 (2004-02-01), None
International Search Report for International application No. PCT/US2006/024399 mailed Oct. 16, 2006.
Written Opinion of the International Searching authority for International application No. PCT/US2006/024399.

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