Flip chip ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Details

C257S777000, C257S700000, C257S737000, C257S686000, C257S778000, C438S667000, C438S108000, C438S613000, C438S107000

Reexamination Certificate

active

06933613

ABSTRACT:
A semiconductor device is disclosed, which comprises a package board in which pads are formed on the upper side of a wiring board, a semiconductor chip in which first bumps are formed on the device-forming surface of the semiconductor chip, second bumps are formed on the back surface of the semiconductor chip, and the semiconductor chip is flipchip-connected to the package board, a capacitor-mounted board in which capacitors are mounted on the upper surface of the capacitor-mounted board, pads are formed on the back surface of the capacitor-mounted board, and the capacitor-mounted board is flipchip-connected to the semiconductor chip, an adhesive resin filled between the semiconductor chip and the package substrate and between the semiconductor chip and the capacitor-mounting board, resin package formed on the package substrate, and a ball grid array comprising a plurality of external terminal balls formed on the back surface of the package substrate.

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