Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-08-23
2005-08-23
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S777000, C257S700000, C257S737000, C257S686000, C257S778000, C438S667000, C438S108000, C438S613000, C438S107000
Reexamination Certificate
active
06933613
ABSTRACT:
A semiconductor device is disclosed, which comprises a package board in which pads are formed on the upper side of a wiring board, a semiconductor chip in which first bumps are formed on the device-forming surface of the semiconductor chip, second bumps are formed on the back surface of the semiconductor chip, and the semiconductor chip is flipchip-connected to the package board, a capacitor-mounted board in which capacitors are mounted on the upper surface of the capacitor-mounted board, pads are formed on the back surface of the capacitor-mounted board, and the capacitor-mounted board is flipchip-connected to the semiconductor chip, an adhesive resin filled between the semiconductor chip and the package substrate and between the semiconductor chip and the capacitor-mounting board, resin package formed on the package substrate, and a ball grid array comprising a plurality of external terminal balls formed on the back surface of the package substrate.
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Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
Le Thao X.
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