Flip chip adaptor package for bare die

Details Flip chip adaptor package for bare die Flip chip adaptor package for bare die

1995-12-19

1998-02-17

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257774, 257778, H01L 2848

Patent

active

057194408

ABSTRACT:
A board connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.

REFERENCES:
patent: 4446477 (1984-05-01), Currie et al.
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5222014 (1993-06-01), Lin
patent: 5434452 (1995-07-01), Higgins, III
patent: 5486723 (1996-01-01), Ma et al.

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