Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2011-07-12
2011-07-12
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257SE21511, C257S668000, C257S780000, C257S781000, C438S612000, C438S666000
Reexamination Certificate
active
07977805
ABSTRACT:
A flexible wiring substrate is provided which realizes a fine pitch of a wiring pattern and improves mechanical strength of the wiring pattern so as to prevent breaks or exfoliation of the wiring pattern. A flexible wiring substrate3of the present invention includes an insulation tape6, and a wiring pattern7formed on the insulation tape6. A thickness of the wiring pattern7is made thinner in a mounting region, where a semiconductor element is connected to, than in a non-mounting region.
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Chu Chris
Harness & Dickey & Pierce P.L.C.
Sharp Kabushiki Kaisha
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