Flexible skin incorporating mems technology

Details Flexible skin incorporating mems technology Flexible skin incorporating mems technology

1998-01-23

2000-06-06

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

438706, 438712, 438719, 438753, H01L 21311

Patent

active

060718196

ABSTRACT:
A flexible skin formed of silicon islands encapsulated in a polyimide film. The silicon islands preferably include a MEMS device and are connected together by a polyimide film (preferably about 1-100 .mu.m thick). To create the silicon islands, silicon wafers are etched to a desirable thickness (preferably about 10-500 .mu.m) by Si wet etching and then patterned from the back side by reactive ion etching (RIE).

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