Flexible multi-chip module and method of making the same

Details Flexible multi-chip module and method of making the same Flexible multi-chip module and method of making the same

2006-11-28

2006-11-28

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C438S107000, C438S108000, C257SE23177, C257SE23179

Reexamination Certificate

active

07141875

ABSTRACT:
A semiconductor package including a flexible multichip module having multiple chips on flexible appendages with the flexible appendages folded so that the semiconductor chips are arranged in aligned and stacked positions.

REFERENCES:
patent: 5646446 (1997-07-01), Nicewarner et al.
patent: 6808955 (2004-10-01), Ma
patent: 2001/0006252 (2001-07-01), Kim et al.
patent: 2001/0008306 (2001-07-01), Kamei et al.
patent: 2002/0044423 (2002-04-01), Primavera et al.
patent: 2002/0090756 (2002-07-01), Tago et al.
patent: 2002/0127773 (2002-09-01), Shibata et al.
patent: 2004/0089880 (2004-05-01), D'Amato et al.

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