Flexible MEMS transducer manufacturing method

Details Flexible MEMS transducer manufacturing method Flexible MEMS transducer manufacturing method

2006-12-19

2006-12-19

Vinh, Lan (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

C438S052000, C438S458000, C438S745000, C257S254000

Reexamination Certificate

active

07151057

ABSTRACT:
A method for manufacturing a flexible MEMS transducer includes forming a sacrificial layer on a flexible substrate, sequentially depositing a membrane layer, a lower electrode layer, an active layer, and an upper electrode layer on the sacrificial layer by PECVD, sequentially patterning the upper electrode layer, the active layer, and the lower electrode layer, depositing an upper protective layer to cover the upper electrode layer, the lower electrode layer, and the active layer, patterning the upper protective layer to be connected to the lower electrode layer and the upper electrode layer, and then depositing a connecting pad layer and patterning the connecting pad layer to form a first connecting pad to be connected to the lower electrode layer and a second connecting pad to be connected to the upper electrode layer; and patterning the membrane layer to expose the sacrificial layer and removing the sacrificial layer.

REFERENCES:
patent: 5789264 (1998-08-01), Chung
patent: 5834975 (1998-11-01), Bartlett et al.
patent: 5914507 (1999-06-01), Polla et al.
patent: 6071819 (2000-06-01), Tai et al.
patent: 6245444 (2001-06-01), Marcus et al.
patent: 6289564 (2001-09-01), Novotny
patent: 6359374 (2002-03-01), Dausch et al.
patent: 6670212 (2003-12-01), McNie et al.
patent: 6677709 (2004-01-01), Ma et al.
patent: 2004/0061543 (2004-04-01), Nam et al.
patent: 1517296 (2004-08-01), None
patent: 08-205273 (1995-08-01), None
French, et al., “Epi-micromachining”, Microelectronics Journal.
Mackintosh Publications Ltd., Luton, GB, vol. 28, No. 4, pp. 449-464 (May 1997).

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