Flexible leads for tape ball grid array circuit

Details Flexible leads for tape ball grid array circuit Flexible leads for tape ball grid array circuit

1995-06-16

1997-02-11

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257737, 257772, 257774, 257780, H01L 2348, H01L 2352, H01L 2940

Patent

active

056024223

ABSTRACT:
A flexible circuit construction includes a polymeric sheet, via holes in the sheet and metal circuitry disposed on the sheet. The circuitry terminates at a cantilever end partially spanning the via hole to which a solder ball is subsequently attached. The cantilever end allows the solder ball to move relative to the flexible circuit and thus compensate for misalignment and-differential thermal expansion effects.

REFERENCES:
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5359222 (1994-10-01), Okutomo et al.
patent: 5420460 (1995-05-01), Massingill
Patent Abstracts of Japan: vol. 11, No. 209 (E-521), 7 Jul. 1987 & JP,A,62,62 030342 (NEC), 9 Feb. 1987, see abstract.

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