Flexible foil finned heatsink structure and method of making sam

Details Flexible foil finned heatsink structure and method of making sam Flexible foil finned heatsink structure and method of making sam

1998-02-06

2000-02-22

Leo, Leonard

Heat exchange

Heat transmitter

165 803, 149 163, 257722, 361690, 361697, 361703, 361704, H05K 720

Patent

active

060268956

ABSTRACT:
Heatsink structures for integrated circuit chips, chip packages, printed wiring boards and the like are disclosed. The heatsink structures according to the present invention have thin flexible cooling fins which move and vibrate under the flow of a cooling fluid. In one embodiment, the fins comprise a thin metal film, such as copper or aluminum, which is laminated to a thin polymeric layer. The polymeric layer provides resilience and elasticity to the metal film and the cooling fins.

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IBM Corporation, "IBM Technical Disclosure Bulletin", "Microfin Cooling", vol. 34, No. 3, Aug. 1991, pp. 424-426.

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