Flexible finned heat exchanger

Details Flexible finned heat exchanger Flexible finned heat exchanger

1986-04-30

1988-03-15

Hart, Douglas

Heat exchange

With retainer for removable article

Electrical component

165 46, F28F 700, H01R 1300

Patent

active

047306661

ABSTRACT:
A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is secured adheringly, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. The heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. The finned sheet may be efficiently fabricated by processes analogous to those used to make printed circuits. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately two mils.

REFERENCES:
patent: 3860949 (1975-01-01), Stoeckert et al.
patent: 3864728 (1975-02-01), Peltz et al.
patent: 3877062 (1975-04-01), Murrmann
patent: 4069498 (1978-01-01), Joshi
patent: 4072188 (1978-02-01), Wilson et al.
patent: 4092697 (1978-05-01), Spaight
patent: 4095253 (1978-06-01), Yoshimura et al.
patent: 4109707 (1978-08-01), Wilson et al.
patent: 4132856 (1979-01-01), Hutchison et al.
patent: 4151547 (1979-04-01), Rhoades
patent: 4222090 (1980-09-01), Jaffe
patent: 4254431 (1981-03-01), Babuka et al.
patent: 4263965 (1981-04-01), Mausuria et al.
patent: 4341432 (1982-07-01), Cutchaw
patent: 4381032 (1983-04-01), Cutchaw
patent: 4451540 (1984-05-01), Baird et al.
patent: 4574876 (1986-03-01), Aid
Antonetti, V. W., Chu, R. C., Moran, K. P. and Simons, R. E. "Compliant Cold Plate Cooling Scheme" IBM Technical Disclosure Bulletin, vol. 21, No. 6, Nov. 1978, p. 2431.
Dombrowskas, R. J. and Patch, P.O., "Conduction Cooled Heat Plate for Modular Circuit Package" IBM Technical Disclosure Bulletin, vol. 13, No. 2, Jul. 1970, p. 442.
B. Tuckerman & Pease "High Performance Heat Sinking for VSLI" IEEE Electron Devices Letters, vol. EDL-2, No. 5, May, 1981 (pp. 126-129), particularly pp. 126,128.
J. Layman "Special Report-Super Computers Demand Innovation in Packaging and Cooling", Electronics, Sep. 22, 1982 (pp. 136-143), particularly p. 142.
D. Buhanan, "CML and Flip Tab Join Forces in the DPS 88's Micropackages", Electronics, Nov. 3, 1982 (pp. 93-99), particularly p. 98,99.

Affiliated with

Also associated with

Rating

Flexible finned heat exchanger does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flexible finned heat exchanger, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flexible finned heat exchanger will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1921532