Flexible film semiconductor package

Details Flexible film semiconductor package Flexible film semiconductor package

1991-03-04

1992-07-14

Hille, Rolf

357 72, H01L 2330, H01L 2304, H01L 2308

Patent

active

051307839

ABSTRACT:
A thin film package is formed using a lost cost TAB interconnection on a semiconductor device and sandwiching the device between thin films of plastic to form a sealed, thin, light weight package for the semiconductor device.

REFERENCES:
patent: 4710798 (1987-12-01), Marcantonio
patent: 4870476 (1989-09-01), Solstad
patent: 5019673 (1991-05-01), Juskey et al.

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