Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-05-21
1987-07-21
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29591, 29827, 29846, 156633, 156634, 156643, 156644, 156652, 156655, 156656, 156668, 156902, 174 685, 361398, 361403, 428601, C23F 102, B44C 122, B29C 3700, C03C 1500
Patent
active
046816542
ABSTRACT:
A method is disclosed for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape is made with window-like openings having a relatively thin layer of polyimide spanning the openings. The relatively thin layer of polyimide is transferred to the tape from a metal carrier foil, preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates which may be handled in the tape format for further processing. Preferably, the tape includes perforations for engaging sprockets of automated manufacturing equipment, or the like.
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Clementi Robert J.
Gazdik Charles E.
Lafer William
Lovesky Roy L.
McBride Donald G.
Adour David L.
International Business Machines - Corporation
Powell William A.
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