Flexible carrier and release method for high volume...

Details Flexible carrier and release method for high volume... Flexible carrier and release method for high volume...

2004-12-10

2008-10-28

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S127000

Reexamination Certificate

active

07442581

ABSTRACT:
Methods and apparatus are provided for use in manufacturing a device packaging comprising the steps of: positioning a metal substrate such as spring steel on a magnetic plate so as to expose a surface of the metal substrate; placing a first tape layer on the exposed surface of a metal substrate so as to expose a nonstick surface of the first tape layer such as PTFE; placing a second tape layer on the exposed surface of the first tape layer so as to expose a surface of the second tape layer; positioning a mold frame on the exposed surface of the second tape layer; positioning a die within the mold frame; depositing epoxy within the mold frame; curing the epoxy so as to create a molded panel; removing the mold frame; grinding the molded panel to a desired thickness; separating the first tape layer from the second tape layer so as to separate the metal substrate from the molded panel; and peeling the second tape layer from the molded panel. The process provides an efficient method for creating a chips first package.

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