Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Patent
1990-06-28
1992-07-07
Heinrich, Samuel M.
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
2281801, 2281802, 29834, 156643, 174254, 174263, 174266, B23K10142, B23K 3102
Patent
active
051275708
ABSTRACT:
A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the surface of the substrate. The metallized interconnects in the pattern span apertures created in the substrate using an excimer laser. Thus, the metallized interconnects can be electrically bonded through the apertures to elements lying underneath the substrate.
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IBM Technical Disclosure Bulletin, "Concept for Forming Multilayer Structures for Electronic Packaging", vol. 30, No. 3, pp. 1353, 1354, Aug. 1987.
August Melvin C.
Christie Diane M.
Dowdle Deanna M.
Dudley Dean B.
Nelson Stephen E.
Cray Research Inc.
Heinrich Samuel M.
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