Flexible attachment flip-chip assembly

Details Flexible attachment flip-chip assembly Flexible attachment flip-chip assembly

1991-08-22

1993-02-23

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

257774, 257776, 257747, H01C 2348, H01C 2944, H01C 2952, H01C 2960

Patent

active

051895056

ABSTRACT:
A multiple chip module (MCM) is fabricated by connecting a series of semiconductor chips, in a flip-chip orientation, to a multi-chip substrate with resilient connection pads. The substrate is formed from silicon by placing a layer of SiO2 on the surface. At the locations requiring a resilient connection pad, the SiO2 layer is pierced with a series of closely spaced holes. A cavity is etched out of the silicon below the closely spaced holes. The SiO2 layer is now suspended over the cavity and forms a flexible membrane. A post is formed on top of the flexible membrane. A conductor formed on the substrate has one end supported by the post. One end of the conductor is, therefor, supported by the post and flexible membrane so that a solder bump placed thereon may be used for a demountable connection to a contact pad on a flip-chip.

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