Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate
2000-01-10
2001-09-18
Clark, Sheila V. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
With housing or contact structure
C257S091000, C257S784000
Reexamination Certificate
active
06291841
ABSTRACT:
BACKGROUND OF THE INVENTION
(1) Field of the Invention
This invention relates to semiconductor packaging, in particular to the interconnection in the package.
(2) Description of Related Art
In a conventional semiconductor package, the connection to the semiconductor device is by wire bonding as shown FIG.
1
. In this example, several light emitting diodes (LED)
10
are mounted on a substrate
14
. At the corner
102
of each LED is a bonding pad as first electrode of the LED. Outside the corner is the light emitting area
106
. The second electrode
104
of the LED is in the back of the LED and is not shown. The first electrode
102
of the LED
10
wire bonded for electrical connection. The wire-bonding process is very labor intensive. It is desirable to eliminate such a process in fabrication.
SUMMARY OF THE INVENTION
An object of this invention is to eliminate the wire bonding for connection to a semiconductor device. Another object of this invention is to provide a semiconductor device package which is suitable for mass production.
These objects are achieved by using flat metal strips to make contacts to the semiconductor device and as interconnections for the device. The strips are parallel to the surface of the semiconductor device, resulting in a lower profile.
REFERENCES:
patent: 4199777 (1980-04-01), Maruyama et al.
patent: 5994722 (1999-11-01), Averbeck et al.
patent: 6180960 (2001-01-01), Kusuda et al.
patent: 6191438 (2001-02-01), Okehara et al.
Clark Sheila V.
Lin Patent Agent H. C.
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