Flashless lead frame with horizontal singulation

Details Flashless lead frame with horizontal singulation Flashless lead frame with horizontal singulation

2006-08-08

2008-08-19

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

C257S670000, C257S666000, C257SE23037

Reexamination Certificate

active

07414302

ABSTRACT:
A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segments. The apparatus applies a downward force to the lead frame segments and translates the downward force to a horizontal force applied to the tie bars. The singulation process confines movement of the lead frame metal to within the plane of the lead frame.

REFERENCES:
patent: 4429559 (1984-02-01), dePuglia et al.
patent: 5197183 (1993-03-01), Chia et al.
patent: 5272800 (1993-12-01), Rooney et al.
patent: 5979510 (1999-11-01), Hamilton
patent: 6251568 (2001-06-01), Hsia et al.
patent: 6269723 (2001-08-01), Ong
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6627976 (2003-09-01), Chung et al.
patent: 2003/0020509 (2003-01-01), SOng et al.

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