Flash memory device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257SE29129

Reexamination Certificate

active

08030699

ABSTRACT:
Disclosed herein is a flash memory device in which the distribution of threshold voltage is significantly reduced and the durability is improved even though a floating gate has a micro- or nano-size length. It comprises a tunneling insulation film formed on a semiconductor substrate; a multilayer floating gate structure comprising a first thin storage electrode, a second thick storage electrode, and a third thin storage electrode, defined in that order on the tunneling insulation film; an interelectrode insulation film and a control electrode formed in that order on the floating gate structure; and a source/drain provided in the semiconductor substrate below the opposite sidewalls of the floating gate structure. The novel flash memory device can be readily fabricated at a high yield through a process compatible with a conventional one.

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“Effects of Buffer Layer Structure on Polysilicon Buffer LOCOS for the Isolation of Submicron Silicon Devices” Jong-Ho Lee, et al., IEEE Transactions on Electron Devices, vol. 45, No. 10, Oct. 1998, pp. 2153-2160.

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