Flagless semiconductor device

Details Flagless semiconductor device Flagless semiconductor device

1994-08-22

1996-05-28

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

257669, 257674, 257676, H01L 23495

Patent

active

055214282

ABSTRACT:
A flagless semiconductor device (10) includes a semiconductor die (22) having a plurality of bond pads (26) which are electrically coupled to a plurality of leads (16) by wire bonds (28). The die is supported by two cantilevered tie bars (18). Use of cantilevered tie bars decreases the total plastic-metal interface area in a plastic encapsulated device, thereby lessening the probability of internal delamination and package cracking. The cantilevered tie bars also permit a variety of die sizes to be used with the same lead frame design. Suitable configurations for cantilevered tie bars include, but are not limited to, U-shape, T-shape, and H-shape configurations.

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