4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Joni Hansen

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Fixture for handling and attaching conductive spheres to a subst

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Method for attaching and handling conductive spheres to a substr

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Profile ID: LFUS-PAI-P-1322607

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