Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2006-07-04
2006-07-04
Potter, Roy (Department: 2822)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C438S687000
Reexamination Certificate
active
07071013
ABSTRACT:
A method and an apparatus for uniform electroless plating of layers onto exposed metallizations in integrated circuits such as bond pads. The apparatus provides means for holding a plurality of wafers, and rotating each wafer at constant speed and synchronous within the plurality. Immersed in a plating solution flowing in substantially laminar motion and at constant speed, the method creates periodic superposition of directions and speeds of the motion of the wafers and the motion of the plating solution. The invention creates periodically changing wafer portions where the directions and speeds are additive and where the directions and speeds are opposed and subtractive. Consequently, highly uniformly layers are electrolessly plated onto the exposed metallizations of bond pads. If the plated layers are bondable metals, the process transforms otherwise unbondable pad metallization into bondable pads.
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Amador Gonzalo
Stierman Roger J.
Brady III Wade James
Potter Roy
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Tung Yingsheng
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