Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-12-06
2005-12-06
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S706000, C257S712000, C257S719000
Reexamination Certificate
active
06972485
ABSTRACT:
The present invention relates to a ball grid array (BGA) chip-fixing device capable of easily fixing the ball grid array (BGA) chip on a printed circuit board (PCB). The device comprises: a fixing box fixed in place on a printed circuit board and having a through-hole; a ball grid array (BGA) chip for being settled within the through-hole of the fixing box to electrically connect with the printed circuit board; a heat sink layered on the upper face of the ball grid array (BGA) chip; a cover fixed over the fixing box; and a pressing unit provided on the underside of the cover for pressing the heat sink in a mounting direction of ball grid array (BGA) chip. The ball grid array (BGA) chip is fixed without soldering, the fixing and separation are simple since the assembly is made via simple screw-fastening, and the ball grid array (BGA) chip can be reused.
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Kim Sun-Gi
Kong Hyung-Ho
Bushnell , Esq. Robert E.
Nguyen DiLinh
Pham Long
Samsung Electronics Co,. Ltd.
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