Fingerprint sensor package

Details Fingerprint sensor package Fingerprint sensor package

2008-01-01

2008-01-01

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C382S124000, C382S125000, C382S126000

Reexamination Certificate

active

10960990

ABSTRACT:
A fingerprint sensor package includes an LSI chip for reading a fingerprint, a substrate having an external connection terminal and to which the LSI chip is fixed, and a chip fixing mechanism for fixing the LSI chip in a state where the LSI chip is deformed so as to form a curved surface, provided between the LSI chip and the substrate.

REFERENCES:
patent: 5818956 (1998-10-01), Tuli
patent: 5991467 (1999-11-01), Kamiko
patent: 6310371 (2001-10-01), Hung
patent: 6392143 (2002-05-01), Koshio
patent: 6548909 (2003-04-01), Brofman et al.
patent: 2003/0068072 (2003-04-01), Hamid
patent: 9-126918 (1997-05-01), None
patent: 2003-235830 (2003-08-01), None

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