Fine pitch solder application

Details Fine pitch solder application Fine pitch solder application

1992-06-05

1993-03-30

Ramsey, Kenneth J.

Metal fusion bonding

Process

Preplacing solid filler

427 96, 427259, 118 59, H01L 2158

Patent

active

051976552

ABSTRACT:
Methods and apparatus are provided for applying solder in precise amounts to fine pitch leads such as those suitable for direct chip attachment (DCA) or flip-chip applications by using a heated platen to apply pressure to solder overlaying a plurality of lands on circuitized substrate. In one embodiment paste solder screened through a mask having apertures each corresponding to a plurality of land locations. In another embodiment, a web of solder foil is accurately positioned over a plurality of fine pitch lands. In each embodiment, a heated platen includes at least one active element corresponding in size and shape to the area having a plurality of fine pitch lands. A third embodiment includes individual platens for lands to which solder is to be applied.

REFERENCES:
patent: 4273859 (1981-06-01), Mones et al.
patent: 4614837 (1986-09-01), Kane et al.
patent: 4684055 (1987-08-01), Baer et al.
patent: 4722470 (1988-02-01), Johary
patent: 4822979 (1989-03-01), deKam
patent: 4832255 (1989-05-01), Bickford et al.
patent: 4854337 (1989-08-01), Bunkenburg et al.
patent: 4871899 (1989-10-01), DuFrenne
patent: 4906823 (1990-03-01), Kushima et al.
patent: 4961955 (1990-10-01), Goldberg

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