Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2006-09-28
2010-11-02
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S697000, C257S724000
Reexamination Certificate
active
07825526
ABSTRACT:
In an example embodiment, there is a package substrate (200) for mounting an integrated circuit (IC) device (205). The package substrate comprises an IC device placement area (290) surrounded by pad landings (215). For placing surface mount devices in vicinity of the pad landings, there is a plurality of component pads (235a,235b,235c,235d). The plurality of component pads surrounds the pad landings (215). A plurality of device pins (225a,225b,225c,225d,245a,245b,245c,245d) surrounds the component pads. One or more of the plurality of device pins, having fine-pitch conductive paths (270), couple the one or more of the plurality of device pins to a set of corresponding pad landings (215) or to a set of corresponding component pads; the fine-pitch conductive paths (270) traverse regions between the plurality of component pads.
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Clark S. V
NXP B.V.
Zawilski Peter
LandOfFree
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