Fine pitch low cost flip chip substrate

Details Fine pitch low cost flip chip substrate Fine pitch low cost flip chip substrate

2008-01-29

2008-01-29

Malsawma, Lex (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21508

Reexamination Certificate

active

07323405

ABSTRACT:
A method of forming a package is disclosed, which includes steps of forming a substrate, a solder masker, and a first aperture through the solder mask. The substrate has a surface on which metal traces are formed. The solder mask covers at least a portion of the surface of the substrate. And the first aperture through the solder mask exposes a plurality of the metal traces.

REFERENCES:
patent: 6622380 (2003-09-01), Grigg

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