Fine pitch bonding method using rectangular wire and capillary b

Details Fine pitch bonding method using rectangular wire and capillary b Fine pitch bonding method using rectangular wire and capillary b

1999-10-20

2000-08-29

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228 495, H01L 21603

Patent

active

061095087

ABSTRACT:
A wire of predetermined cross section is provided and fed through a capillary having a bore of predetermined shape and sufficiently larger dimensions so that the wire can be fed through the bore without impediment and without being rotatable within the bore. The capillary is applied to the surface to which the bond is to be made with the smallest cross sectional dimension of the wire disposed between the surface to be bonded and any adjacent wires or bonds in order to minimize the possibility of contact with the adjacent wires or bonds. By utilizing a shaped wire having one narrow dimension and one wide dimension, the space between bond locations required to accommodate the wire can be decreased whereas the total current carrying capacity can be the same as in the case of round wires by having the same cross sectional area as the round wire since the wide dimension is directed away from any adjacent bond locations or the like. In other words, the wire to wire clearance is improved by using the shaped wire. The exterior shape of the capillary is arbitrary and is preferably that of the type having a pair of escalloped opposing regions. The external shape of the capillary is made to accommodate the conditions of the bonding procedure involved. The cross sectional dimension of the capillary in the direction of the narrow cross sectional dimension of the bore and wire can be reduced and still accommodate the shaped wire relative to the round wire.

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