Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-04-24
1990-12-11
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156653, 156655, 156656, 156657, 1566591, 1566611, 156668, 2504923, 427 38, 427 431, 430296, 430317, 430318, B44C 122, B29C 3700, C03C 1500, C23F 102
Patent
active
049768182
ABSTRACT:
A fine pattern forming method capable of forming an accurate fine pattern without charge-up at the time of electron beam or focus ion beam exposure, by treating the bottom layer or intermediate layer or silicon containing resist of a multi-layer resist with ion shower irradiation or reducing solvent.
REFERENCES:
patent: 4068018 (1975-09-01), Hashimoto
patent: 4222792 (1979-09-01), Lever
patent: 4311785 (1982-01-01), Ahne et al.
patent: 4465768 (1984-08-01), Ueno et al.
patent: 4504646 (1985-03-01), Nate et al.
patent: 4521274 (1985-06-01), Reichmanis
patent: 4556619 (1985-12-01), Ogata et al.
patent: 4615782 (1986-10-01), Namatsu
patent: 4649099 (1985-07-01), Oguchi
patent: 4702993 (1987-03-01), White
patent: 4764247 (1988-08-01), Leveriza
Hashimoto Kazuhiko
Kawakita Kenji
Koizumi Taichi
Nomura Noboru
Matsushita Electric - Industrial Co., Ltd.
Powell William A.
LandOfFree
Fine pattern forming method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fine pattern forming method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fine pattern forming method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-388008