Fine pattern forming method

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156653, 156655, 156656, 156657, 1566591, 1566611, 156668, 2504923, 427 38, 427 431, 430296, 430317, 430318, B44C 122, B29C 3700, C03C 1500, C23F 102

Patent

active

049768182

ABSTRACT:
A fine pattern forming method capable of forming an accurate fine pattern without charge-up at the time of electron beam or focus ion beam exposure, by treating the bottom layer or intermediate layer or silicon containing resist of a multi-layer resist with ion shower irradiation or reducing solvent.

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patent: 4615782 (1986-10-01), Namatsu
patent: 4649099 (1985-07-01), Oguchi
patent: 4702993 (1987-03-01), White
patent: 4764247 (1988-08-01), Leveriza

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