Fine-line die and method of making same

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

1566591, 1566611, 156905, 156515, 430306, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

044976860

ABSTRACT:
A method for fabricating a precision die having a line-and-space array by chemical milling the working face of an etchable workpiece to form a plurality of raised die elements separated and bounded by a plurality of cavities, including separating cavities and background cavities, is comprised of the steps of forming an etchant-resistant surface pattern of pockets penetrating slightly into the working face of the workpiece and at least partially overlapping and substantially conforming to the spatial disposition of a desired configuration for the die elements to be produced, and then selectively etching the workpiece in etchant-active regions intermediate and outwardly bounded by the pockets to undercut the same and form at least the conformation of the separating/background cavities within the working face. The step of forming the etchant-resistant pattern of pockets is preferably a two-stage procedure comprised of first chemical milling shallow pockets in the workpiece in the desired pattern and then loading those pockets with an etchant-resistant fill extending in an oversized pattern with respect to the surface width dimension of the die elements. The workpiece is selectively milled in the etchant-active regions to form cavity precursors having a surface width dimension approximately equal to the desired width for the spaces in the finished die; followed by selectively milling the regions intermediate those cavities to establish raised die elements conforming to the line array of the finished die.

REFERENCES:
patent: 4437924 (1984-03-01), Weglin
patent: 4447286 (1984-05-01), Weglin

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