Fine-line circuit fabrication and photoresist application theref

Details Fine-line circuit fabrication and photoresist application theref Fine-line circuit fabrication and photoresist application theref

1977-12-28

1982-02-16

Kimlin, Edward C.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

204 15, 1566591, 427160, 427346, 430318, 430323, 430324, 430327, 430330, 430935, G03C 500, G03C 176

Patent

active

043159850

ABSTRACT:
A method is disclosed for the production of thick and smooth layers of photoresist on the order of 2-15 microns thick. The substrate is flooded with resist as in the standard spin resist method, but instead of following the flooding step with spinning as usual, the second step is to provide a drying time for the flooded resist. Then at the end of the measured drying time, the resist is spun as usual. This can be used to produce fine line closely spaced circuitry in which the thickness of the lines in proportion to their width, or their aspect ratio, is large. Aspect ratios greater than 0.4 and as high as 1.5 are contemplated by the invention.

REFERENCES:
patent: 3576722 (1971-04-01), Fennimore
"Plating", May 1969, pp. 505-510, Duffek.
Proceedings of the Second Kodak Seminar on Micro-Miniaturization, Apr. 4-5, 1966, pp. 36-43.
Data Release, Incidental Intelligence About Kodak Resists, pp. 8-10.
Data Release, Kodak Autopositive Resist Type 3, Kodak Pamphlet No. P-194, (1969).

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