Fine gold wire for use in connection in a semiconductor device

Details Fine gold wire for use in connection in a semiconductor device Fine gold wire for use in connection in a semiconductor device

1976-12-28

1978-03-21

Andrews, M. J.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

75165, 357 67, C22C 500

Patent

active

040804852

ABSTRACT:
A fine wire made of a gold alloy for use in a semiconductor device. The alloy consists essentially of at least one control element selected from the group consisting of carbon in an amount of 1 to 25 wt. ppm., silicon in an amount of 1 to 25 wt. ppm., germanium in an amount of 3 to 30 wt. ppm., tin in an amount of 5 to 30 wt. ppm., and lead in an amount of 5 to 30 wt. ppm.; with balance gold of a purity of more than 99.995 wt.

REFERENCES:
wise, E. M., Gold, Van Nostrand Co., 1964, pp. 345-354.
Davis, G. L., Gold Bulletin, vol. 7, No. 4, 1974, p. 92.

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