Fin field effect transistors (FinFETs) and methods for...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S192000, C257S401000, C257S202000

Reexamination Certificate

active

11132652

ABSTRACT:
In a first aspect, a first method is provided for semiconductor device manufacturing. The first method includes the steps of (1) forming a first side of a fin of a fin field effect transistor (FinFET); (2) processing the first side of the fin; and (3) forming a second side of the fin while supporting the first side of the fin. Numerous other aspects are provided.

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patent: WO 2005/038930 (2005-04-01), None
“Turning Silicon On Its Edge”, IEEE Circuits & Devices Magazine, Jan./Feb. 2004, Edward J. Nowak, Ingo Aller, Thomas Ludwig, Keunwoo Kim, Rajiv V. Joshi, Ching-Te Chuang, Kerry Bernstein, and Ruchir Puri, pp. 20-31.
“Improved Independent Gate N-Type FinFET Fabrication and Characterization”, IEEE Electron Device Letters, vol. 24, No. 9, Sep. 2003, David M. Fried, Jon S. Duster and Kevin T. Kornegay, pp. 592-594.
“A Fin-Type Independent-Double-Gate NFET”, David M. Fried, Edward J. Nowak, Jakub Kedzierski, Jon S. Duster, Kevin T. Kornegay, AIMS Research Group, 330 Phillips Hall, Cornell University, Ithaca, New York, 14853, pp. 45-46.
“High-Performance P-Type Independent-Gate FinFETs”, IEEE Electron Device Letters, vol. 25, No. 4. Apr. 2004, David M. Fried, Jon S. Duster and Kevin T. Kornegay, pp. 199-201.
“High-performance symmetric-gate and CMOS-compatible Vt asymmetric-gate FinFET devices”, IEEE 2001, Jakub Kedzierski, et al, IEDM 01-437-440.

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