Fin Field-effect transistor and method for producing a fin...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S377000, C257S382000, C257S471000

Reexamination Certificate

active

10768971

ABSTRACT:
A fin field effect transistor having a substrate, a fin structure above the substrate, as well as a drain region and a source region outside the fin structure above the substrate. The fin structure serves as a channel between the source region and the drain region. The source and drain regions are formed once the gate has been produced.

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Ishii, T. et al: “Characterization of One-Dimensional Conduction in an Ultra-Thin Poly-Si Wire”; Extended Abstracts of the International Conference on Solid State Devices and Materials, Japan Society of Applied Physics. Tokyo, Japan, Aug. 21, 1995, pp. 201-203.
Hisamoto, Digh et al: “A Fully Depleted Lean-Channel Transistor (DELTA)—A Novel Vertical Ultrathin SOI MOSFET”; IEEE Electron Device Letters, vol. 11, No.1, Jan. 1990, pp. 36-38.
Hisamoto, Digh et al: “A Folded-Channel MOSFET for Deep-sub-tenth Micron Era”; IEDM 98, pp. 1032-1034, 1998.
Kedzierski, Jakub et al: “Complementary silicide source/drain thin-body MOSFETS for the 20nm gate length regime”; IEDM 2000, pp. 57-60.

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