Film substrate, fabrication method thereof, and image...

Details Film substrate, fabrication method thereof, and image... Film substrate, fabrication method thereof, and image...

2008-09-16

2008-09-16

Le, Thao X. (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C349S150000

Reexamination Certificate

active

11043946

ABSTRACT:
In a film substrate (FB) including a film base material (1) and conductor wiring (23) that is formed on the film base material (1), the conductor wiring (23) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) (25) at other positions.

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