Film forming process

Details Film forming process Film forming process

1992-03-19

1994-01-04

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156655, 156656, 1566591, B44C 100

Patent

active

052756939

ABSTRACT:
A first film having a low adhesion to a base material (substrate) is deposited on a base material. Pores reaching at least the surface of the base material are then formed through the first film at a high pore density (porosity), for example, according to photolithographic etching technology. Thereafter, a second film having a high adhesion to the base material is formed over the porous first film to fix, or secure, the porous first film to the base material. Recesses may be formed in a surface portion of the base material to further improve the fixation of the porous first film to the base material.

REFERENCES:
patent: 3152938 (1964-10-01), Osifchin et al.
patent: 4407695 (1983-10-01), Deckman et al.
patent: 4642163 (1987-02-01), Greschner et al.
patent: 4645734 (1987-02-01), Takada et al.
patent: 4664748 (1987-05-01), Ueno et al.
patent: 4784023 (1988-11-01), Dennis

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