Film forming method, semiconductor device manufacturing...

Details Film forming method, semiconductor device manufacturing... Film forming method, semiconductor device manufacturing...

2005-10-03

2010-12-07

Richards, N Drew (Department: 2895)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S626000, C438S648000, C438S656000, C438S678000, C438S685000, C257SE21584

Reexamination Certificate

active

07846839

ABSTRACT:
An adhesion between a Cu diffusion barrier film and a Cu wiring in a semiconductor device is improved and reliability of the semiconductor device is improved. A film forming method for forming a Cu film on a substrate to be processed is provided with a first process of forming an adhesion film on the Cu diffusion barrier film formed on the substrate to be processed, and a second process of forming a Cu film on the adhesion film. The adhesion film includes Pd.

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