Film forming method, film forming apparatus, pattern forming...

Details Film forming method, film forming apparatus, pattern forming... Film forming method, film forming apparatus, pattern forming...

2007-12-25

2007-12-25

Huff, Mark F. (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S322000, C430S324000, C430S270100, C430S330000, C430S327000, C427S294000, C427S350000, C427S333000, C427S352000

Reexamination Certificate

active

10927141

ABSTRACT:
There is disclosed a film forming method comprising continuously discharging a solution adjusted so as to spread over a substrate by a given amount to the substrate through a discharge port disposed in a nozzle, moving the nozzle and substrate with respect to each other, and holding the supplied solution onto the substrate to form a liquid film, wherein a distance h between the discharge port of the nozzle and the substrate is set to be not less than 2 mm and to be in a range less than 5×10−5qγ (mm) given with respect to a surface tension γ (N/m) of the solution, discharge speed q (m/sec) of the solution continuously discharged through the discharge port, and a constant of 5×10−5(m·sec/N)

REFERENCES:
patent: 5622747 (1997-04-01), Todd et al.
patent: 5803970 (1998-09-01), Tateyama et al.
patent: 5952050 (1999-09-01), Doan
patent: 5965200 (1999-10-01), Tateyama et al.
patent: 6062288 (2000-05-01), Tateyama
patent: 6063190 (2000-05-01), Hasebe et al.
patent: 6092937 (2000-07-01), Snodgrass et al.
patent: 6120834 (2000-09-01), Terauchi
patent: 6162745 (2000-12-01), Ito et al.
patent: 6231917 (2001-05-01), Ito et al.
patent: 6410080 (2002-06-01), Ito
patent: 6416583 (2002-07-01), Kitano et al.
patent: 6475285 (2002-11-01), Ikegami et al.
patent: 6506453 (2003-01-01), Ema et al.
patent: 6709699 (2004-03-01), Ema et al.
patent: 1304167 (2001-07-01), None
patent: 59-92530 (1984-05-01), None
patent: 2-220428 (1990-09-01), None
patent: 2-233174 (1990-09-01), None
patent: 6-151295 (1994-05-01), None
patent: 7-321001 (1995-12-01), None
patent: 8-222502 (1996-08-01), None
patent: 8-316311 (1996-11-01), None
patent: 9-92134 (1997-04-01), None
patent: 2000-77307 (2000-03-01), None
patent: 2000-77326 (2000-03-01), None
patent: 2000-79366 (2000-03-01), None
patent: 2000-188251 (2000-07-01), None
patent: 2001-148338 (2001-05-01), None
patent: 2001-168021 (2001-06-01), None
patent: 2001-170546 (2001-06-01), None
patent: 2001-176765 (2001-06-01), None
patent: 2001-176781 (2001-06-01), None
patent: 2001-176786 (2001-06-01), None
patent: 2001-232250 (2001-08-01), None
patent: 2001-232269 (2001-08-01), None
patent: 2001-237179 (2001-08-01), None
patent: 2001-239198 (2001-09-01), None
patent: 2001-291660 (2001-10-01), None
Shinichi Ito, “Liquid Film Forming Method and Solid Film Forming Method”, U.S. Appl. No. 10/202,657, filed Jul. 25, 2002.
Nobuhide Yamada et al., “Method of Forming Coating Film, Method of Manufacturing Semiconductor Device and Coating Solution”, U.S. Appl. No. 10/112,951, filed Apr. 2, 2002.
Shinichi Ito et al., “Film Formation Method, Semiconductor Element and Method Thereof, and Method of Manufacturing a Disk-Shaped Storage Medium”, U.S. Appl. No. 09/842,403, filed Apr. 26, 2001.
Tatsuhiko Ema et al., “Film Forming Method, Film Forming Apparatus and Liquid Film Drying Apparatus”, U.S. Appl. No. 09/961,288, filed Sep. 25, 2001.
Notification of Reasons for Rejection issued by the Japanese Patent Office, mailed Oct. 19, 2004, in Japanese Patent Application No. 2002-022382, and English-language translation thereof.
Notification of Reasons for Rejection issued by the Japanese Patent Office, mailed Oct. 19, 2004, in Japanese Patent Application No. 2002-031911, and English-language translation thereof.
First Notification of Reasons for Rejection, issued by Chinese Patent Office, dated Feb. 4, 2005, in Chinese Patent Application No. 03102108.5, and English-language translation thereof.
Notification of Reasons for Rejection from the Japanese Patent Office, dated Oct. 31, 2006, in counterpart Japanese Patent Application No. 2004-367913.

Affiliated with

Also associated with

Rating

Film forming method, film forming apparatus, pattern forming... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Film forming method, film forming apparatus, pattern forming..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film forming method, film forming apparatus, pattern forming... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3892510