Film forming method, and film modifying method

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate

Reexamination Certificate

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Details

C427S561000, C427S564000, C427S584000, C427S255310, C427S255360, C427S255350

Reexamination Certificate

active

07037560

ABSTRACT:
A film forming and film modifying method utilizing a film forming apparatus which has an alcohol supply unit to form a metal oxide film on a semiconductor wafer in a vacuum atmosphere in which a vaporized metal oxide film material and a vaporized alcohol exist. The film modifying method irradiates a UV ray on ozone to generate active oxygen atoms, thus modifying the metal oxide film by exposing the metal oxide film to the active oxygen atoms in a vacuum atmosphere.

REFERENCES:
patent: 4540466 (1985-09-01), Nishizawa
patent: 4597986 (1986-07-01), Scrapple
patent: 4687544 (1987-08-01), Bersin
patent: 4711790 (1987-12-01), Morishige
patent: 4716852 (1988-01-01), Tsujii
patent: 5021396 (1991-06-01), Fujita et al.
patent: 5225355 (1993-07-01), Sugino et al.
patent: 5376628 (1994-12-01), Sekiguchi et al.
patent: 5387546 (1995-02-01), Maeda et al.
patent: 5397597 (1995-03-01), Soga et al.
patent: 5510158 (1996-04-01), Hiramoto et al.
patent: 5538905 (1996-07-01), Nishioka et al.
patent: 5618388 (1997-04-01), Seeser et al.
patent: 5666640 (1997-09-01), Daniylchev
patent: 5683537 (1997-11-01), Ishii
patent: 5698472 (1997-12-01), Harris
patent: 5763892 (1998-06-01), Kizaki et al.
patent: 5792326 (1998-08-01), Harada et al.
patent: 5863843 (1999-01-01), Green et al.
patent: 5914151 (1999-06-01), Usuki
patent: 6155198 (2000-12-01), Danek et al.
patent: 6224934 (2001-05-01), Hasei et al.
patent: 6228173 (2001-05-01), Okase et al.
patent: 6399922 (2002-06-01), Okase et al.
patent: 6402848 (2002-06-01), Horiguchi et al.
patent: 6465055 (2002-10-01), Harada
patent: 6537422 (2003-03-01), Sakuma et al.
patent: 6649218 (2003-11-01), Qian
patent: 6756235 (2004-06-01), Liu et al.
patent: 2001/0018267 (2001-08-01), Shinriki et al.
patent: 2002/0022379 (2002-02-01), Ashizawa et al.
patent: 2005/0074983 (2005-04-01), Shinriki et al.
patent: 2005/0191864 (2005-09-01), Nishiguchi et al.
patent: 5-247650 (1953-09-01), None
patent: 61-39524 (1986-02-01), None
patent: 1-298003 (1989-12-01), None
patent: 02-283022 (1990-11-01), None
patent: 7-86270 (1995-03-01), None
patent: 07-273101 (1995-10-01), None
patent: 8-31817 (1996-02-01), None
patent: 1995-8733 (1995-04-01), None
Translation to JP01298003 to Matsuoku et al, Dec. 1989.
Translation to JP 2-283,022 to Hiroshi Jinriki et al, Nov. 1990.

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