Coating processes – Centrifugal force utilized
Patent
1998-08-18
2000-12-26
Beck, Shrive
Coating processes
Centrifugal force utilized
427420, 427425, 118 52, 118DIG4, B05D 140
Patent
active
06165552&
ABSTRACT:
A film-forming method comprises the steps of: (a) holding a rectangular substrate by a spin chuck provided in a cup; (b) positioning a solvent supply nozzle above the rectangular substrate and supplying a solvent to the rectangular substrate, the solvent supply nozzle having a liquid discharge port which has a length at least corresponding to that of a peripheral portion of the rectangular substrate; (c) positioning a process liquid supply nozzle above the rectangular substrate and supplying a process liquid to a portion at a rotation center portion of the rectangular substrate, thereby to form a film; (d) rotating the rectangular substrate in the cup to adjust a film thickness of the film; and (e) thereafter positioning the solvent supply nozzle above one peripheral portion of the rectangular substrate and supplying the solvent to the one peripheral portion of the rectangular substrate, whereby the film is removed from the one peripheral portion of the rectangular substrate, the substrate being subsequently rotated by the spin chuck to position the solvent supply nozzle to another peripheral portion of the rectangular substrate, whereby the film is removed from the another peripheral portion of the rectangular substrate.
REFERENCES:
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patent: 5658615 (1997-08-01), Hasebe et al.
patent: 5688322 (1997-11-01), Motoda et al.
patent: 5695817 (1997-12-01), Tateyama et al.
patent: 5750317 (1998-05-01), Orth
patent: 5853803 (1998-12-01), Tateyama et al.
patent: 5919520 (1999-07-01), Tateyama et al.
Anai Noriyuki
Omori Tsutae
Sakai Mitsuhiro
Takizawa Masaaki
Beck Shrive
Crockford Kirsten A.
Tokyo Electron Ltd.
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