Film-forming method

Details Film-forming method Film-forming method

2004-11-24

2009-08-04

Cameron, Erma (Department: 1792)

Coating processes

With post-treatment of coating or coating material

Heating or drying

C427S384000, C427S385500

Reexamination Certificate

active

07569253

ABSTRACT:
A film-forming method is provided in which generation of an edge bead can be prevented even in a case where the thickness of a coating solution is large, and includes the steps of applying a coating solution onto a substrate to be treated such that thickness of the coating solution is 20 μm or more, placing the substrate into a heating space defined within an oven unit in which heating devices are provided in upper and lower portions of the heating space, and heating the substrate at a temperature-rising rate of 80 to 120° C./10 min so as to remove a solvent within the coating solution while keeping the substrate in a non-contact state with respect to the heating devices.

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patent: 4794021 (1988-12-01), Potter
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patent: 6609909 (2003-08-01), Aoki et al.
patent: 7005009 (2006-02-01), Aoki et al.
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patent: 7166184 (2007-01-01), Nakamura et al.
patent: 917184 (1999-05-01), None
patent: 917184 (1999-05-01), None
patent: 2002-324745 (2002-11-01), None

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