Film formation apparatus and method for using the same

Details Film formation apparatus and method for using the same Film formation apparatus and method for using the same

2011-06-14

2011-06-14

Norton, Nadine G (Department: 1713)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S022100, C134S026000, C134S902000, C118S066000

Reexamination Certificate

active

07959737

ABSTRACT:
A method for using a film formation apparatus for a semiconductor process includes a first cleaning process of removing by a first cleaning gas a by-product film from an inner surface of a reaction chamber of the film formation apparatus, while supplying the first cleaning gas into the reaction chamber, and setting an interior of the reaction chamber at a first temperature and a first pressure to activate the first cleaning gas. The method further includes a second cleaning process of then removing by a second cleaning gas a contaminant from the inner surface of the reaction chamber, while supplying the second cleaning gas into the reaction chamber, and setting the interior of the reaction chamber at a second temperature and a second pressure to activate the second cleaning gas. The second cleaning gas includes a chlorine-containing gas.

REFERENCES:
patent: 5709757 (1998-01-01), Hatano et al.
patent: 6503843 (2003-01-01), Xia et al.
patent: 7288284 (2007-10-01), Li et al.
patent: 2003/0037802 (2003-02-01), Nakahara et al.
patent: 03-293726 (1991-12-01), None

Affiliated with

Also associated with

Rating

Film formation apparatus and method for using the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Film formation apparatus and method for using the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film formation apparatus and method for using the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2686195