Film for thermal stencil sheets having specific thermal stresses

Details Film for thermal stencil sheets having specific thermal stresses Film for thermal stencil sheets having specific thermal stresses

1992-08-20

1994-11-01

Thibodeau, Paul J.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

428331, 428333, 428338, 428340, 428480, B32B 516

Patent

active

053606655

ABSTRACT:
A novel film material for thermal stencil sheets is disclosed. The film comprises a biaxially stretched polyester film which contains 0.1-5.0% of fine particles having an average diameter of 0.05-2.0 .mu.m and has a melting point of 170.degree.-230.degree. C. and a thickness of 0.5-2.5 .mu.m and the maximum value of an average longitudinal and transversal thermal construction stress of the film at a temperature of 100.degree.-160.degree. C. is 500-1500 g/mm.sup.2. The film for heat-sensitive mimeographic printing stencil sheets of the present invention is excellent in handling property sensitivity to thermal perforation, resolution in printing, tone property and curling resistance and thus the invention is industrially very significant.

REFERENCES:
patent: 5061565 (1991-10-01), Aoki et al.
patent: 5085933 (1992-02-01), Katoh et al.
patent: 5089341 (1992-02-01), Yoshimura et al.
patent: 5100719 (1992-03-01), Endo et al.
patent: 5106681 (1992-04-01), Endo et al.
patent: 5188881 (1993-02-01), Sugiyama et al.

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