Film deposition method and film deposition apparatus of...

Details Film deposition method and film deposition apparatus of... Film deposition method and film deposition apparatus of...

2006-06-28

2011-10-04

Gambetta, Kelly M. (Department: 1715)

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

C427S248100, C427S250000

Reexamination Certificate

active

08029873

ABSTRACT:
The present invention is a film deposition method of a metal film comprising the steps of: placing an object to be processed having a recess formed in a surface thereof, on a stage in a processing vessel; evacuating the processing vessel to create a vacuum therein; ionizing a metal target in the evacuated processing vessel to generate metal particles including metal ions, by means of a plasma formed by making the plasma from an inert gas; and by applying a bias electric power to the object to be processed placed on the stage to draw the plasma and the metal particles into the object to be processed, scraping a bottom part of the recess to form a scraped recess, and depositing a metal film on an entire surface of the object to be processed including surfaces in the recess and in the scraped recess.

REFERENCES:
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patent: 2004/053926 (2004-06-01), None
PCT Notification of Transmittal of Translation of the International Preliminary Examination Report (Form PCT/IB/338) dated Jan. 2004.
PCT International Preliminary Report on Patentability (Form PCT/IPEA/409) dated Apr. 2005.

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