Film deposition method

Details Film deposition method Film deposition method

2007-05-29

2007-05-29

Chen, Bret (Department: 1762)

Coating processes

Direct application of electrical, magnetic, wave, or...

Plasma

C427S162000, C427S255390

Reexamination Certificate

active

10858178

ABSTRACT:
A film deposition method and film deposition system for depositing a halogen compound film, capable of depositing such a film while suppressing abuse that occurs due to deficiency of a halogen element even if the halogen element is dissociated from a film material. The halogen compound film is deposited through a process including: evaporating a film material comprising a halogen compound by means of an evaporation source3; ionizing the evaporated film material with a radio frequency power outputted from a radio frequency power supply unit11and supplied through a substrate holder2; and causing the ionized film material deposit on the substrate5. A bias voltage outputted from a bias power supply unit12and applied to the substrate holder2causes halogen ions dissociated from ions of the halogen compound to be incorporated into the film being deposited on the substrate5.

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