Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1998-03-26
2000-11-28
Potter, Roy
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257667, 257738, H01L 23495
Patent
active
061539252
ABSTRACT:
A reinforcing ring surrounding a semiconductor element connected electrically to respective interconnecting portions through electrodes is provided as one body through suspending portions. A film circuit is produced by forming a ring in place of an outer lead for instance by applying a lead frame forming technique in which a laminate of three layers or more is used as a base, an inner lead is formed on one side and an outer lead is formed by a surface layer on another side. In this manner, in a film circuit composed of an insulating film and a plurality of interconnecting portions (leads) electrically connecting between electrodes and other electronic components of a semiconductor element on at least one principal plane of the insulating film, it is made possible to align a ring surrounding a semiconductor element with respect to the semiconductor element only by placing the film circuit on the semiconductor element, and in its turn to reduce assembly mandays of a semiconductor device.
REFERENCES:
patent: 4079511 (1978-03-01), Grabbe
patent: 5444299 (1995-08-01), Tsukada et al.
patent: 5585600 (1996-12-01), Froebel et al.
patent: 5714405 (1998-02-01), Tsubosaki et al.
Osawa Kenji
Sato Kazuhiro
Potter Roy
Sony Corporation
LandOfFree
Film circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Film circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film circuit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1728575