Film carrier tape for use in tape automated bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

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257669, 257672, H01L 23495

Patent

active

056867573

ABSTRACT:
A film carrier tape for use in TAB, having a lead wiring of a desired shape, and formed on a base film having a sprocket hole for conveyance and positioning, for connecting electrode pads of a semiconductor chip, includes a corner slit formed in at least one portion of four corner portions of a suspender positioned between a device hole and outer lead holes so as to vertically communicate.

REFERENCES:
patent: 4918511 (1990-04-01), Brown
patent: 5153708 (1992-10-01), Ohikata et al.
patent: 5243141 (1993-09-01), Yonehara
patent: 5289032 (1994-02-01), Higgins, III et al.

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