Film carrier tape for semiconductor package and...

Details Film carrier tape for semiconductor package and... Film carrier tape for semiconductor package and...

2005-07-19

2005-07-19

Lam, Cathy F. (Department: 1775)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S050510, C257S668000, C257S674000, C257S701000, C257S723000, C438S110000, C438S125000, C438S464000, C428S192000

Reexamination Certificate

active

06919513

ABSTRACT:
A film carrier tape and a method of forming a film carrier tape that incorporates a polymeric reinforcement film are provided for decreasing the deformation of and damage to film carrier tapes by forces resulting from contact with sprocket teeth during the semiconductor assembly process. The reinforcement film may include one or more synthetic resins and may increase the useable area of a base film used in forming film carrier tapes.

REFERENCES:
patent: 5345039 (1994-09-01), Yamazaki
patent: 6320135 (2001-11-01), Saito
patent: 6509630 (2003-01-01), Yanagisawa
patent: 6740966 (2004-05-01), Nakamura

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