Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1996-06-25
1998-10-13
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257779, H01L 2348
Patent
active
058216260
ABSTRACT:
A film carrier comprising, on a laminate of an insulating layer and a conductive circuit, a conductive part to be connected to an external substrate and an energy introduction part to supply an energy to connect a semiconductor element, a semiconductor device, and a method for mounting a semiconductor element. The present invention has enabled provision of fine-pitched or highly dense wiring of a semiconductor element, and assures easy and dependable electric construction of the present invention wherein an energy for connection is supplied from the energy introduction part to make a connection of a film carrier to semiconductor element is advantageous in that attenuation of the energy for connection due to an insulating layer occurs less, since the energy for connection can be directly introduced into conductive circuit, thus enabling efficient utilization of the energy, which in turn permits easy and efficient mounting of a semiconductor element.
REFERENCES:
patent: 5475236 (1995-12-01), Yoshizaki
Hino Atsushi
Morita Shoji
Ouchi Kazuo
Sugimoto Masakazu
Nitto Denko Corporation
Potter Roy
Thomas Tom
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