Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
Patent
1990-04-27
1991-07-09
Prenty, Mark
Electricity: electrical systems and devices
Safety and protection of systems and devices
With specific current responsive fault sensor
357 72, 361421, 361520, H01L 2348, H01L 2328, H05K 502, H01G 114
Patent
active
050310224
ABSTRACT:
An IC chip is packaged on a film carrier. The film carrier comprises an insulation film and many conductive leads formed on the insulation film in predetermined patterns. Each of the leads has an inner lead portion to be connected to a terminal of the IC chip, and an outer lead portion to be connected to a conductive pattern of a mounting board. The film carrier further comprises an embankment, which is made of insulation material and formed on and/or in the vicinity of the outer lead portions of the leads to prevent an ooze of resin when the IC chip is sealed with the resin.
REFERENCES:
patent: 4218701 (1980-08-01), Shirasaki
Ohikata Naoharu
Ohno Jiro
Osada Michio
Saito Tamio
Yamamoto Toshio
Nippon Steel Corporation
Prenty Mark
Towa Corporation
LandOfFree
Film carrier for mounting IC chips does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Film carrier for mounting IC chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film carrier for mounting IC chips will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-622132